Chiplet Center of Excellence (CCoE)

Our Mission for novel, industry-ready chiplet solutions in close pre-competitive research partnership with industry:

"The Chiplet Center of Excellence transforms the broad spectrum of automotive application requirements and constraints into a manageable set of workflows, design rules and evaluation procedures. It enables an early assessment of the feasibility of chiplet-based system solutions."

WHY - CCoE

Chiplets represent one of the most fundamental disruptions since the start of Moore’s Law

By creating a common chiplet development methodology and shaping a multi-vendor chiplet ecosystem in Europe, CCoE supports the competitiveness and technological sovereignty of strong European industrial sectors (focused on automotive applications in the first two years).

 

HOW - CCoE

Unique joint interdisciplinary work to enable novel, industry-ready chiplet solutions

For a fast industrialization of the new chiplet technologies in automotive industry, CCoE brings together experts from design, tooling, technology and application along the automotive value chain working on methodologies and roadmaps with impact on chiplet ecosystem as well as standardization bodies.

 

WHAT - CCoE

Applied research on advanced chiplet solutions

To establish common guidelines for a development, production and testing methodology for chiplets, CCoE will conduct research activities following a state-of-the-art review considering the disciplines "Architectures", "Design & Design Methods", "Manufacturing" and "Test & Reliability".

 

News

3 D / 2.5 D System Integration Workshop

Take advantage of this unique opportunity to deepen your knowledge in advanced electronic packaging.

Industry Workshop on Sep 5, 2024 in Dresden

Around 20 industry representatives from the automotive value chain gained detailed insight into the CCoE work to date and the next milestones.

Chiplet Center of Excellence officially started

Learn more about the Chiplet Center of Excellence

Andy Heinig

Contact Press / Media

Andy Heinig

Head of Chiplet Center of Excellence

Fraunhofer IIS, Division Engineering of Adaptive Systems EAS
Münchner Straße 16
01187 Dresden, Germany

Phone +49 351 45691-250