Chiplet Center of Excellence
Chiplet Center of Excellence

About the Center

Fraunhofer establishes the Chiplet Center of Excellence (CCoE), which is a unique research activity based on Fraunhofer‘s long experience and broad research portfolio in design, implementation and test of 2.5 and 3D integrated electronic systems. 

The center aims at establishing a common understanding among the partners from research and industry in a sector and at creating a suitable chiplet development methodology as well as a tool set. This goal is supplemented by recommendations to shape a multi-vendor chiplet ecosystem. To support the success of these results in industrial practice, the methodological approaches are to be incorporated into standards.

The joint work of Fraunhofer and its industrial partners focuses on strong European industrial sectors and will support competitiveness and technological sovereignty.

For the first two years, starting 2024, the CCoE will focus on automotive applications and their specific requirements. 

Chiplet Center of Excellence: Participating Fraunhofer Institutes

Fraunhofer IIS/EAS

The Fraunhofer Institute for Integrated Circuits IIS stands for cutting-edge international research into microelectronic and information technology system solutions. The scientists at the EAS branch in Dresden are working on new design concepts to counter the constant miniaturization of semiconductor components and the growing complexity of integrated circuits. The branch also contributes this expertise to the work at the CCoE. For example, application-specific design processes, new packaging concepts for chiplet solutions, test structures or adapted interface IP are developed. The overall management of the Chiplet Center of Excellence is also based here.

 

Fraunhofer IZM

For over 30 years, Fraunhofer IZM has been one of the world's leading institutions for applied research and development of robust and reliable electronics and their system integration at wafer, chip and board level. More than 450 employees find technological solutions for future challenges such as high-end performance packaging, quantum sensor technology, hardware security and bioelectronics, sustainable 6G applications or chiplets. At the Chiplet Center of Excellence, Fraunhofer IZM will be responsible for the realization of demonstrators and in particular contribute its expertise in wafer-level assemblies and substrates. Process lines for 200 and 300 mm 3D wafer level processes and a 600 mm substrate line are available for this purpose.

 

Fraunhofer ENAS

Fraunhofer ENAS is a research and development partner in the field of intelligent systems for a wide range of applications. The Chemnitz-based institute contributes its many years of expertise in testing, reliability evaluation and the characterization of solutions in the field of electronics and smart systems integration to the CCoE. Fraunhofer ENAS will develop methods for the virtual testing and prototyping of chiplet components and systems, with which the functionality and reliability of chiplet solutions can be optimized in a significantly more time and resource-efficient manner.